-
Flow range
0.5SCCM~5000SLPM -
Accuracy
±0.5~1.0%Rd -
Pressure
5kPaA~2MPaA -
Gas temperature
-50 ℃~110 ℃
Specifications
| Model | E100 | E200 | E300 | E400 | E450 |
| Flow range | 20SCCM～500SLPM | 10SCCM～500SLPM | 0.5SCCM～5000SLPM | 2SCCM～2000SLPM | 2SCCM～2000SLPM |
Accuracy | ±1.0%F.S. (2%～100% F.S.) | ±1.0%Rd(30%～±100%F.S.) ±0.3%F.S.(1%～30%F.S.) | ±1.0%Rd(20%～100%F.S. | ±1.0%Rd(10%～100%F.S.) | ±0.5%Rd(20%～100%F.S.) |
| Repeatability | ±0.2%F.S. | ±0.2%Rd(20%～100%F.S. | ±0.1%Rd(20%～100%F.S.) | ||
Pressure shift | ≤±0.1%F.S./100kPa（Benchmark 100kPaA) | ≤±0.1%Rd/100kPa（Benchmark 100kPaA) | |||
Temperature shift | ≤±0.05%F.S./℃（Benchmark 25℃） | ≤±0.02%F.S./℃（Benchmark 25℃） | |||
| Operating range | 2%～100%F.S. | 1%～100%F.S. | 0.5%～100%F.S. | ||
| Response time | ≤100ms | ||||
| Warm-up time | ≤1s | ||||
| Gas temperature | 0℃～50℃ | -20℃～60℃ | |||
| Ambient temperature | 0℃～50℃ | -20℃～60℃ | |||
| Pressure drop | 12kPa（≤5SLPM）；60kPa（10SLPM）；8kPa（20~50SLPM）；10kPa（100SLPM）； | ||||
| Proof pressure | 1.5 MPaA | ||||
| Max pressure | 900kPaA | ||||
| Leak rate | ≤1×10-10 Pa·m³/s He | ||||
| Power supply voltage | 24VDC(±20%) | ||||
| Current consumption | <150mA（＜3.6W） | ||||
| Mounting orientation sensitivity | None | ||||
| Process connectors | G thread、VCR、Swagelok、IGS | ||||
| Wetted materials | SUS316L、FKM、FFKM、EPDM、Neoprene | ||||
| Sealing | Rubber ring seal：FKM、FFKM、EPDM、Neoprene | ||||
| Communication | RS485、PROFIBUS、EtherCAT，PROFINET，DeviceNet、4～20mA / 0～5V | ||||
Application scenarios
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semiconductor equipment
Hydrogen energy and fuel cell technology
Gas control of biological fermentation tanks
Burner control
vacuum coating equipment
Preparation of new materials such as silicon carbon negative electrode
Vacuum heat treatment equipment
>
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